flip chip package meaning in English
晶构装
Examples
- The report of determination for interface delamination propagation rate of real flip chip packages is hardly found up to now
目前，测定实际倒装焊封装界面分层传播速率报道尚少见。 - The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations
本文针对倒装焊封装可靠性问题进行了实验和数值模拟两方面的研究。 - Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。 - Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。 - To our knowledge , for real flip chip packaging under the thermal loading , the paris equation obtained from experiment da / dn and simulation g is firstly reported here , and will be useful practically
本文在热循环加载条件下对实际倒装焊封装给出实验da / dn和模拟g关系的paris方程，属首次报导。